• Equipment Manufacturers
» Assembly and Packaging Equipment
› Cleaning; Washing Equipment for Assembly and Packaging
› Die Bonding; Attach Equipment
› Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
› Wire Bonding Equipment
» Wafer Processing Equipment
› Bumping Systems
› CMP
› Cleaning; Washing Equipment for Assembly and Packaging
› Coat/Develop/Resist Processing Track
› Deposition; (CVD, PVD, ALD, Plating)
› Etching/Stripping/Ashing
› Lithography/Exposure
› Thermal Processing
» Test Equipment
› Burn-In Systems
» Other Equipment
› Space simulation; Vacuum chambers
› Vacuum drying and out gassing Systems
› Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
» Nanotechnology Equipment or Tools
› Equipment, Nanotechnology
» Photovoltaic Equipment
› PV Equipment
› PV Equipment: Wafers
› PV Equipment: Other
• Materials Manufacturers
» Flat Panel Display Materials
› Liquid Crystal Materials
» Mask / Mask Making Materials
› Transfer lithography masks; Polymer masks; templates (for Nanoimprint)
» Process Materials
› Plasma; Ion Sources
» PV Materials
› PV Materials: Other
• Sub-Systems or Components or Parts
» Sub-systems
› Plasma Sources; Controls; Monitoring; Diagnosis
» Components, Parts and Accessories
› Sealants; Adhesives; Finishes
• Manufacturing Services or Consulting (including Those Services or Consulting directly related to Manufacturing)
» Manufacturing Services
› Deposition Service
› Etch; Strip; Cleaning Service
› Lithography; Patterning service